Scheda elettronica con componenti avanzati e connessioni digitali

Thermal analysis of electronics for time and cost optimization

Simcenter Flotherm XT

What is Simcenter Flotherm XT?

Simcenter Flotherm XT is an electronic cooling simulation software, CAD-centric, which allows you to reduce the time to market, get the desired product from the first attempt. It allows you to eliminate design iterations by linking and integrating MCAD and ECAD workflows.

It can successfully meet the challenge of increasing product miniaturization by rapidly optimizing the design of components such as heat sinks, fans, TECs, or liquid cooling through the use of parametric studies.

Ingegnere analizza il design termico di un microchip al computer

Why choose Simcenter Flotherm XT for thermal analysis in electronics?

THE MOST COMPLETE AND ACCURATE SOLUTION ON THE MARKET
Simcenter Flotherm XT is the most complete and accurate solution on the market, with a reputation of more than 30 years of development. Siemens software is dedicated to specialists in thermal analysis of electronic systems.
THERMAL SIMULATION HAS NEVER BEEN EASIER
Although Flotherm XT is a tool for simulating electronic devices of any complexity, it is really simple to use. Its integration into a 3D CAD workspace allows designers to import their mechanical design. In addition, Smartpart™ technology enables users to quickly build electronic components such as heat sinks, cases, fans.
A TECHNOLOGY DEDICATED TO ELECTRONICS
Flotherm XT is a solution dedicated to the Thermal Analysis of Electronics and Simulation of Electronic Cooling. Technologies such as PCB import in ODB++ format, FLOEDA Bridge, and Joule effect make designers confident of the thermal performance of their devices.
EFFECTIVE COVERAGE OF THE ENTIRE SUPPLY CHAIN
Flotherm XT has already implemented libraries of electronic components (IC packages, fans, heatsinks, TECs, etc.) available for designers. Full support for PDML files enables easy and effective import of thermal models from the entire supply chain.

Simcenter Flotherm XT supports the entire supply chain of the’electronics

Electronic products are designed in stages. Different companies design and manufacture different parts and sub-assemblies; each makes assumptions about how these are cooled, and designs them according to that prediction. For example, a CPU for a computer can be designed so that heat can be easily removed through a heatsink attached to the top of the package.

Then, thermal design is performed from the integrated circuit, chip, or die level down to the data centers. Suppliers provide thermal models to assist their customers with their thermal design at the next level of packaging.

While thermal design is important at every level, it should be optimized for cost, weight, volume, etc., for the final product. Optimization at the final product level is possible by creating a 3D CFD model of the entire system in Simcenter Flotherm XT at the process ideation stage. In addition, Simcenter Flotherm has SmartPart™ technology and a library infrastructure to support the supply chain.