Webinar | The management of heat in electronic systems - how to realize the digital thermal twin starting from the E-CAD model

July 4, 3 pm.00

One of the current main challenges of electronic design is related to product thermal management.
The need to make increasingly compact electronic boards forces the designer to handle smaller and smaller volumes resulting in higher thermal power density to be disposed.
The main challenges of the designer are:

 

• the automatic construction of the PCB thermal model from the electronic CAD model
• the assessment of the thermal performance of the product already in the design stages
• the individuation and removal of any heating-related problems of electronic components

In this Webinar we will illustrate the complete workflow of thermal analysis, starting from ecad drawing to results.

Participate to stay updated on all the latest analysis methodologies in this domain