PCB Design Simulator is a set of features included in the Xpedition Enterprise design flow and powered by HyperLynx for high-speed PCB simulation
These capabilities enhance simulation of analog/mixed signals; electrical rule checking for SI, PI, and EMI problems; power supply integrity analysis; signal integrity analysis; and thermal analysis. The PCB Design Simulator tools provided by Siemens, made possible by HyperLynx, can increase design performance, minimize design revisions, and bring products to market faster.
Analysis of signal integrity
HyperLynx Signal Integrity generates fast, easy, and accurate signal integrity analysis in PCB system design.
Designers can efficiently manage the exploration, definition, and validation of rules, ensuring that the engineering intent is fully achieved.
The software is tightly integrated into the design flow, from schematic design to final layout verification.
Designers can efficiently manage the exploration, definition, and validation of rules, ensuring that the engineering intent is fully achieved.
The software is tightly integrated into the design flow, from schematic design to final layout verification.
Power integrity analysis
HyperLynx PI identifies potential power supply integrity distribution issues that may interfere with board design logic, investigates and validates solutions in an easy-to-use "what-if" environment.
This intuitive tool gives any member of the design team the ability to quickly and accurately analyze the integrity of feeds, without the usual steep learning curve of most feed analysis products.
The design team's access to these sophisticated power integrity capabilities will help companies reduce multiple prototype runs, shorten time to market, and enable engineers to develop more reliable products.
Full-Wave/Hybrid Em Analysis
HyperLynx Full-Wave Solver offers unprecedented speed and capability through accelerated boundary element technology, while retaining the accuracy the precision of excellence of Maxwell. Get greater accuracy and fewer re-spins, even on the most complex structures.
Designers can take advantage of the high speed, accuracy, and capability for signal integrity, power supply integrity, and EMI concerns, all from a common interface. The EM solver is built from the ground up to take advantage of multi-core and hybrid architectures and to use the best of fast solver technology to enable rapid simulation on a single core or multiple cores.
Extraction of the SI Power-aware trace model can be performed, as well as system-level DC and AC power integrity analysis (package/PCB). Designers can benefit from power grid impedance profiling, capacitor loop inductance, and combined extraction of broadband signal and power S-parameters for use in time-domain simulation, all within a common, easy-to-use interface.
Designers can take advantage of the high speed, accuracy, and capability for signal integrity, power supply integrity, and EMI concerns, all from a common interface. The EM solver is built from the ground up to take advantage of multi-core and hybrid architectures and to use the best of fast solver technology to enable rapid simulation on a single core or multiple cores.
Extraction of the SI Power-aware trace model can be performed, as well as system-level DC and AC power integrity analysis (package/PCB). Designers can benefit from power grid impedance profiling, capacitor loop inductance, and combined extraction of broadband signal and power S-parameters for use in time-domain simulation, all within a common, easy-to-use interface.
Thermal analysis
HyperLynx Thermal analyzes board-level thermal conditions on positioned, partially routed, or fully routed PCBs. It simulates conduction, convection, and radiation and produces temperature profiles, gradients, and excess temperature maps, allowing you to solve the problem of board and component overheating early in the design process.
By modifying the design using hypothetical scenarios, engineers and PCB designers can reduce the mean time between failures by up to 50 percent, improving product quality and decreasing warranty costs.
By modifying the design using hypothetical scenarios, engineers and PCB designers can reduce the mean time between failures by up to 50 percent, improving product quality and decreasing warranty costs.
Vibration and acceleration analysis
Due to design flaws, newly launched electronic products currently experience a field failure rate of 15-20% in the first year, resulting in warranty claims and high levels of returns. Xpedition Design for Reliability (DFR) enables early detection of PCB design vulnerabilities due to physical use, reducing costs and shortening cycle times. Xpedition DFR offers two options for rapid PCB design simulation: Vibration Analysis and Constant Acceleration.
Simulation of analog/mixed signal circuits
Xpedition AMS expands SPICE-based standard circuit analysis to leverage industry advances in PCB modeling and simulation, accelerate circuit development and speed verification.
Quasistatic extraction
HyperLynx Fast 3D Solver enables the creation of complete and efficient models with multi-processing for faster turnaround times.
It is ideal for power integrity, low-frequency SSN/SSO and full SPICE pattern generation, taking into account the impact of skin effect on resistance and inductance. Fast Solver technologies enable rapid simulation on single and multiple cores.
It is 20-100 times faster than other equivalent solutions and maintains gold-standard full-3D EMQS accuracy. The intuitive user interface allows users to work with the latest system-in-package (SIP), package-on-package (POP), stacked die and multi-chip module (MCM) scenarios to easily extract accurate models with minimal extraneous effort on boundary conditions and port definitions.
Whether the specific application is related to a high-performance microprocessor design, a low-cost ASIC and system design, power integrity, signal integrity, or simultaneous switching noise, effective solutions are available for all types of designs.
It is ideal for power integrity, low-frequency SSN/SSO and full SPICE pattern generation, taking into account the impact of skin effect on resistance and inductance. Fast Solver technologies enable rapid simulation on single and multiple cores.
It is 20-100 times faster than other equivalent solutions and maintains gold-standard full-3D EMQS accuracy. The intuitive user interface allows users to work with the latest system-in-package (SIP), package-on-package (POP), stacked die and multi-chip module (MCM) scenarios to easily extract accurate models with minimal extraneous effort on boundary conditions and port definitions.
Whether the specific application is related to a high-performance microprocessor design, a low-cost ASIC and system design, power integrity, signal integrity, or simultaneous switching noise, effective solutions are available for all types of designs.
Learn about all the features of Xpedition Enterprise for PCB Design, PCB Simulation and DFM