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What is Semiconductor Testing?
Power electronic components such as MOSFETs, diodes, transistors, and IGBTs are used wherever electrical power is generated, converted and controlled.
Because power demands in industrial and consumer applications are increasing, the challenge for power module manufacturers is to increase the maximum power level and current load capacity while maintaining high quality and reliability.
Simcenter semiconductor testing products accelerate and optimize the design process of such components, using dedicated and innovative measurement technology for thermal transient analysis, LED analysis, TIM Testing, Power Cycling, and package testing in the laboratory or factory.
Why choose Siemens products for Semiconductor Testing?
FAST, EASY, REPEATABLE All Siemens Semiconductor Testing solutions are quick to implement and operationalize, very easy to use, and offer a repeatable measurement system for reliable results.
COMPLIANCE WITH JEDEC STANDARDS Siemens Semiconductor Testing products enable component manufacturers to follow the standards set by JEDEC to improve product quality and reliability, and increase consumer confidence.
NON-DESTRUCTIVE TESTING You can perform all the necessary tests in the same component because nondestructive testing for thermal characterization gives you the component structure function, which is optimal for package characterization.
INTEGRATION WITH ELECTRONIC THERMAL SIMULATION With Simcenter's Semiconductor Testing products, highly accurate thermal models can be generated for use with Simcenter Flotherm XT and FLOEFD to improve the accuracy of thermal simulations.
- T3STER
Simcenter T3STER is an advanced nondestructive transient thermal tester for thermal characterization of semiconductor devices with packages (diodes, BJTs, power MOSFETs, IGBTs, power LEDs) and multi-die devices. It measures the true transient thermal response more efficiently than stationary methods.
Measurements are at ±0.01 °C with a time resolution down to 1 microsecond. Structure functions process the response after the process in a graph showing the thermal resistance and capacity of the package features along the heat flow path.
Simcenter T3STER is an ideal tool for pre- and post-stress fault detection. Measurements can be exported for thermal model calibration, supporting the accuracy of the thermal design effort.
- POWERTESTER
Simcenter POWERTESTER offers the industry's unique ability to combine active power cycles with transient thermal characterization and thermal structure investigation. Non-destructive structure-function evaluation is performed while the device remains mounted, providing a complete electrical and structural evaluation of the device during the test program in a fully automated manner.
Powered by thousands, potentially millions, of cycles, the modules provide real-time ongoing fault diagnosis, reduce testing and diagnosis time, and eliminate the need for post-mortem or destructive fault analysis. A wide range of power strategies simulates realistic operating conditions in the field. Configurations provide up to 3600A and measure up to 16 devices simultaneously.
- TERALED
The Simcenter T3STER thermal characterization hardware and the Simcenter TERALED temperature-controlled testing stage form a combined electrical, thermal, and radiometric/photometric test station for LEDs and LED modules, creating compact multi-domain models that can be used in Simcenter thermal design software.
These LED test solutions comply with the JEDEC JESD51-52 standard and follow the CIE 127:2007 and 225:2017 technical reports. Actual thermal resistance and light output metrics are measured as a function of actual LED junction temperature over a wide range of drive current.
The process is fully automated. Third-party spectroradiometers help capture emission spectra, providing additional input for precise modeling of the light output properties of the LED package in lighting design.
- DYNTIM
Simcenter DYNTIM offers an intelligent implementation of the standard ASTM D5470, based on transitory rather than static measurements, with highly accurate control of bond line thickness in 1 µm steps to maximize measurement accuracy. Automatic control of sample thickness or pressure makes it ideal for soft samples and specially prepared metal samples, complementing existing thermal conductivity test systems. It is available as a stand-alone system or as a fixture for Simcenter T3STER, and fully automates the measurement process, saving time and effort while offering 5% repeatability under measurement conditions close to the actual application. Simple and robust, the system è easy to use.
How structure functions improve package characterization
The Structure Functions are critical for investigating packet integrity in semiconductor testing. Thermal transient testing performed by Simcenter T3STER and Structure Functions has become a widely accepted analysis tool.
Watch this video to learn what Structure Functions are, what the principles behind them are, and how they can support packet characterization and reliability analysis.
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