DDR4 PDN Simulation and Measurement

This paper describes an example of Industry 4.0 - the Fraunhofer Future Packaging Line, presented at the SMT exhibition in Nuremberg in 2017. The Fraunhofer exhibit presented a concept of the world's first open, multi-vendor, connected surface-mount technology (SMT) IoT line, demonstrating the technology and opportunities for mutually beneficial business models that result from IoT connectivity.