Circuito elettronico con linee di rete sovrapposte che rappresentano la connettività
The all-encompassing tool for electromagnetic simulation

HyperLynx 3D Electromagnetic Simulation Software

What is HyperLynx 3d electromagnetic simulation software?

HyperLynx 3D Electromagnetic Simulation Software is a 3D electromagnetic simulation tool that enables the creation of complete and efficient models with faster multi-processing response times. It is ideal for power integrity, low-frequency SSN/SSO, and full SPICE pattern generation, taking into account the effects of skin effect on resistance and inductance.

HyperLynx Fast 3D Solver is a Siemens tool that provides accurate Maxwell quasi-static parasitic extraction for complex packages such as stacked dies. Detailed coupling matrices and IBIS package templates can be quickly generated, either directly or through integration with Xpedition Package Integrator.

HyperLynx Fast 3D Solver is part of HyperLynx, a comprehensive family of analysis and simulation tools for high-speed electronic design created by Siemens.

rimo piano di un circuito stampato con tracce e componenti elettronici
Why choose HyperLynx Fast 3D solver as 3D Electromagnetic Simulation Software?
  • EXTREME PRECISION

    This 3D electromagnetic simulation software handles all geometries without assumptions about the reference plane. It offers broadband pattern extractions at several GHz and ensures high-frequency skin effect modeling for resistance and inductance.

  • EXTREME PERFORMANCES

    HyperLynx Fast 3D Solver has a fast quasi-static extractor that quickly creates complete system SPICE netlists. Ensures multi-machine parallelization for fast execution times. You can count on nearly linear core scaling that efficiently uses all CPU resources.

  • EXTREME USABILITY

    HyperLynx Fast 3D Solver is easy to use; any designer can perform EM analysis. Its automation environment integrates EM analysis into the design flow. SI and PI modeling are available in a single environment.

  • SILICON-PACKAGE-BOARD CO-ANALYSIS

    All products in the HyperLynx Advanced Solvers family feature chip, package, and board import capabilities from industry-standard formats, with the ability to merge designs of different formats to provide seamless co-analysis of board packages.

3D animation for a complete understanding of power density

HyperLynx Advanced Solvers provides power density animation graphs showing how a structure conducts, reflects, or dissipates energy.
Learn about all the features of the HyperLynx family for PCB simulation and analysis
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