
The new frontier in PCB simulation
Increasing performance requirements and the growing pressure to improve product quality are prompting design teams to consider alternatives to their current simulation approach.
Best practices in design processes suggest using the Digital Twin, a virtual model of the project, from the very beginning and throughout development to minimize re-spins and shorten the overall design cycle.
This “Shift Left” approach allows engineers and layout designers to perform validation directly within their native environment.
With the help of PCB simulation software, they can reduce bottlenecks caused by waiting for specialists’ reviews and allow those specialists to focus on the most critical issues.

A project can be canceled for many reasons, including delays or the loss of resources to support more critical or overdue projects. Having two to four re-spins per project is often considered normal.
However, studies have also shown that the cost of correcting defects found during the design process increases rapidly as the process progresses.
Traditional approaches rely on prototype-lab simulations, attempting to identify problems by observing prototypes or completed products.
This approach, however, often requires technical experts who work with complex, non-integrated tools. Design processes that depend heavily on simulation specialists tend to be inefficient.
As product and design complexity increases, it is no surprise that the complexity of the tools and related processes also grows.
First, the usability and sophistication of tools typically increase with the complexity of the models needed to validate a design.
Additionally, simulation tools are often focused on a single type of problem and lack integration, forcing users to learn multiple platforms and manually combine results.
Finally, due to the complexity of both the tools and the problems being solved, companies frequently rely on simulation specialists.
FAQ
PCB simulation analyzes the electrical and thermal behavior of a printed circuit board before prototyping: signal integrity (SI), power integrity (PI), electromagnetic compatibility and heat dissipation. It helps prevent malfunctions and reduce board revisions.
Var Industries offers HyperLynx for signal and power integrity analysis and 3D electromagnetic modeling of high-speed PCBs, Simcenter Flotherm XT and Simcenter FLOEFD for thermal simulation and cooling of electronic devices, and Simcenter tools for semiconductor thermal testing.
It means bringing verification forward to the early stages of the design: designers and layout designers run analyses in their own working environment, without waiting for specialist reviews or the prototype. This way defects are found when they are cheapest to fix.
Because the cost of fixing a defect grows rapidly throughout the development process, and relying solely on the prototype often leads to 2–4 re-spins per project. According to research cited by Siemens, 58% of new product projects incur additional costs and delays.